|
Type of Defect |
Alternate Name(s) |
Description |
| Al layer defect (1/2) |
Black Spot |
Pin hole caused by contamination |
|
Al layer defect (2/2) |
|
Discoloration or Crack of the aluminium layer caused by chemical reaction (as time elapse) |
| Black Speck (1/3) |
Black Spot, Inclusion, Contamination |
Contamination of Organic substances |
|
Black Speck (2/3) |
Black Spot, Inclusion, Contamination |
Contamination of Inorganic substances |
| Black Speck (3/3) |
Black Spot, Inclusion, Contamination |
Burnt layers of PC coming and/or peeling off from cylinder or nozzle inner wall |
|
Black Streak |
Black Speck, Black Spot |
Black Streak |
| Brittle Disk |
Broken disk, Crack, Crazing |
Brittle Disk |
|
Broken Disk |
Brittle disk, Crack, Crazing |
Breakage of disc caused by a physical force, during punching or ejection |
| Brown Discoloration |
|
Burnt PC (or Contamination of Colorants) |
|
Brown Streak |
Brown Discoloration |
Streak of Brown Discolored PC caused by degradation |
| Cold Slug |
Cold Flow |
Type of Flow Mark caused by a particle of cooled (rigid) material |
|
Disc Deformation |
|
Substrate surface deformed by Tooling parts (including Stamper) |
| Flashing |
|
Membrane generating on the periphery of the disc caused by excessive material |
|
Flow Mark |
Jetting, (Cold Slug) |
Surface defect caused by insufficient flow of material |
| Optical Defect (1/2) |
Bump |
Optical defect on substrate caused by tooling |
|
Optical Defect (2/2) |
|
Optical defects caused by contamination (or void) |
| Rough Center Hole |
Crack, Crazing |
Rough center hole |
|
Silver Streak (1/2) |
Gas Streak, Moisture Streak |
White (or silver) streak running on the surface of the substrate along the flow of material |
| Silver streak (2/2) |
Heat Streak, Burning streak, (Cold Slug) |
White (or silver) streak running on the surface of the substrate along the flow of material |
|
Sink Mark |
|
Thickness of the disk becoming thinner than the mold cavity |
| String |
|
String of PC extending from the nozzle |
|
Void (1/2) |
Bubble |
Vacuumed area or air inclusion |
| Void (2/2) |
|
Hole in the PC substrate caused by Hydrolysis (as time elapse) |
|
Whiten Surface |
|
Hydrolysis of PC (as time elapse) |
