|
Type of Defect: |
Al layer defect (1/2) |
|
Description: |
Pin hole caused by contamination |
|
Observation Method: |
Visible by the human eye |
|
Recommendation Upon Observation: |
Observe the disk with a light source behind it/ visible as a bright spot |
|
Other Evaluation Method: |
|
|
|
|
Cause |
Countermeasure |
Contamination generating during molding
Airborne dirt on the substrate surface, coming from outside of the molding machine |
Check cleanness of the clean booth (including air filter performance) |
Contamination generating during molding
PC fines on substrate surface, coming from the Puncher (generally caused by unsuitable punching condition) |
see Rough Center Hole |
Contamination generating during the conveying from molding machine to sputter
Dust (eg. Fines, dirt) on substrate surface |
Check cleanness of the conveying system and the clean booth (including air filter performance) |
|
Contamination generating in the sputter chamber |
Check cleanness of the sputter chamber (including target quality) |
